Numerical and experimental approach of temperature prediction in speed – stroke grinding

In order to sastify industrial demand raises for high efficient grinding, a state – of – the – art technology, namely speed – stroke grinding, turns out to be a promising recently. The major goals of this technology are to reduce process temperatures by changing the chip formation mechanisms and thereby to avoid thermally-induced structure changes. However, at high table speeds, temperature histories for a complete overrun and temperature gradients at the surface layers during processes are impossible to measure directly. Therefore, a comprehensive numerical model is highly required to calculate temperature during grinding processes. This paper presents a developed numerial model to simulate temperature distribution in grinding by connecting multi-influenced input parameters. This research indicates that more realistic temperature fields can be obtained and this numerical model can be suitably expanded to various grinding processes.